公开(公告)号：US20230091182A1

公开(公告)日：2023-03-23

申请号：US17482294

申请日：2021-09-22

Applicant: QUALCOMM Incorporated

Inventor： Chien-Te FENG ,  Wen YIN ,  Jay Scott SALMON

IPC: H01L23/522 ,  H01L23/36 ,  H01L23/00 ,  H01L23/60 ,  H01L21/56 ,  H01L23/31

Abstract: A device comprising a package and a board. The package includes a substrate comprising a first surface and a second surface, a passive component coupled to the first surface of the substrate, an integrated device coupled to the second surface of the substrate, a back side metal layer coupled to a back side of the integrated device, a first solder interconnect coupled to the back side metal layer, and a plurality of solder interconnects coupled to the second surface of the substrate. The board is coupled to the package through the plurality of solder interconnects. The first solder interconnect is coupled to the board.