公开(公告)号：US20200373080A1

公开(公告)日：2020-11-26

申请号：US16422174

申请日：2019-05-24

Applicant: QUALCOMM Incorporated

Inventor： Rui TANG ,  Chenqian GAN ,  Zhongning LIU

IPC: H01F27/34 ,  H05K1/16 ,  H01F41/04

Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.

公开(公告)号：US20240047131A1

公开(公告)日：2024-02-08

申请号：US18490449

申请日：2023-10-19

Applicant: QUALCOMM Incorporated

Inventor： Rui TANG ,  Chenqian GAN ,  Zhongning LIU

IPC: H01F27/34 ,  H01F41/04 ,  H05K1/16

CPC classification number: H01F27/346 ,  H01F41/041 ,  H05K1/165 ,  H04B1/525

Abstract: A substrate that includes at least one dielectric layer and an inductive coupler formed in the at least one dielectric layer. The inductive coupler includes a first inductor and a second inductor. The first inductor is formed in the at least one dielectric layer. The first inductor is configured to be electrically coupled to a transmitter filter and an antenna. The second inductor is formed in the at least one dielectric layer. The second inductor is configured to be electrically coupled to the transmitter filter and ground. The second inductor is configured to provide a path to ground for a rejected signal having a rejected frequency. The second inductor is configured such that the rejected signal traveling through the second inductor causes the first inductor to generate an induced signal that counteracts a leakage signal traveling through the transmission filter.

公开(公告)号：US20190252316A1

公开(公告)日：2019-08-15

申请号：US16254735

申请日：2019-01-23

Applicant: QUALCOMM Incorporated

Inventor： Shu ZHANG ,  Daniel Daeik KIM ,  Chenqian GAN ,  Bonhoon KOO ,  Babak NEJATI

IPC: H01L23/522 ,  H01L49/02 ,  H01L23/64 ,  H01F27/28 ,  H01F41/04

CPC classification number: H01L23/5227 ,  H01F17/0013 ,  H01F17/02 ,  H01F27/2804 ,  H01F41/042 ,  H01F2017/002 ,  H01F2017/0073 ,  H01F2027/2809 ,  H01L23/52 ,  H01L23/645 ,  H01L28/10

Abstract: Some features pertain to a substrate, and a first inductor integrated into the substrate. The first inductor includes a plurality of first inductor windings in a first metal layer and a second metal layer. A second inductor is integrated into the substrate. The second inductor includes a first spiral in a third metal layer. The first spiral is located at least partially inside the plurality of first inductor windings, wherein the second inductor is perpendicular to the first inductor.