公开(公告)号：US20230221789A1

公开(公告)日：2023-07-13

申请号：US18000319

申请日：2021-07-28

Applicant: QUALCOMM Incorporated

Inventor： Giby SAMSON ,  Smeeta HEGGOND ,  Jitu Khushalbhai MISTRY ,  Paras GUPTA ,  Keyurkumar Karsanbhai KANSAGRA ,  Kamesh MEDISETTI ,  Ramaprasath VILANGUDIPITCHAI ,  Arshath SHEEPARAMATTI

IPC: G06F1/3296 ,  G06F1/26 ,  G06F1/3234

CPC classification number: G06F1/3296 ,  G06F1/263 ,  G06F1/3275

Abstract: A system on chip (SOC) comprising: first memory block and a second memory block; a processing unit coupled to the first memory block and the second memory block; a first power multiplexor disposed between the first memory block and the second memory block and coupled to a first power rail configured to provide an operating voltage to both the first memory block and the second memory block; and enable logic circuitry disposed at a periphery of the SOC away from the first memory block and the second memory block, the enable logic being coupled to control terminals of the first power multiplexor.