公开(公告)号：US12267946B2

公开(公告)日：2025-04-01

申请号：US17673347

申请日：2022-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Jason Gonzalez ,  Lili Xu

IPC: H05K1/02 ,  G06F1/28 ,  H05K1/11 ,  H05K1/18

Abstract: A system for power delivery network (“PDN”) isolation includes a multi-layer printed circuit board (“PCB”) in which a power distribution layer has a root conductive region and two or more branch conductive regions fanning out from the root conductive region. Each branch conductive region is insulated from other branch conductive regions by a non-conductive region. Each branch conductive region has at least one power delivery connection. Each of various electronic circuits mounted on the PCB and sharing the same PDN may be shorted to one of the branch conductive regions.

公开(公告)号：US20230262874A1

公开(公告)日：2023-08-17

申请号：US17673347

申请日：2022-02-16

Applicant: QUALCOMM INCORPORATED

Inventor： Jason Gonzalez ,  Lili Xu

IPC: H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  G06F1/28

CPC classification number: H05K1/0216 ,  H05K1/181 ,  H05K1/112 ,  G06F1/28

Abstract: A system for power delivery network (“PDN”) isolation may include a multi-layer printed circuit board (“PCB”) in which a power distribution layer has a root conductive region and two or more branch conductive regions fanning out from the root conductive region. Each branch conductive region may be insulated from other branch conductive regions by a non-conductive region. Each branch conductive region may have at least one power delivery connection. Each of various electronic circuits mounted on the PCB and sharing the same PDN may be shorted to one of the branch conductive regions.