公开(公告)号：US10168752B2

公开(公告)日：2019-01-01

申请号：US15190181

申请日：2016-06-23

Applicant: QUALCOMM INCORPORATED

Inventor： Kwangyoon Lee ,  Kai Yee Wan ,  Adam Cunningham ,  Melanie Dolores Oclima

IPC: G06F1/00 ,  G06F1/26 ,  G06F1/32

Abstract: Various embodiments of systems and methods are disclosed for determining a thermal power envelope. One method comprises determining a set of component and operating point combinations for a plurality of components in a portable computing device. Each component and operating point combination in the set defines an available operating point for each of the plurality of components. The portable computing device is iteratively set to each of the component and operating point combinations in the set. At each of the component and operating point combinations, power consumption data and skin temperature data is collected from a plurality of temperature sensors. An enhanced thermal power envelope is generated comprising the power consumption data and the skin temperature data for each of the component and operating point combinations.