CORE FREQUENCY/COUNT DECISION-BASED THERMAL MITIGATION OPTIMIZATION FOR A MULTI-CORE INTEGRATED CIRCUIT

    公开(公告)号:US20180167878A1

    公开(公告)日:2018-06-14

    申请号:US15448300

    申请日:2017-03-02

    CPC classification number: H04W52/029 H04W52/0251 H04W52/0258 H04W52/0261

    Abstract: Systems, methods, and computer programs are disclosed for providing optimal power/performance thermal mitigation in a portable computing device having a plurality of processing cores. An exemplary method comprises storing a power sweep table defining a power consumption value for each of a plurality of core frequency and core count combinations for an integrated circuit having a plurality of processing cores. A search table is generated by filtering the power sweep table based on one or more configuration parameters associated with the integrated circuit. A target power level is selected to sustain a thermal power envelope for the integrated circuit. The search table is traversed to find one of the plurality of core frequency and core count combinations having a corresponding power consumption value that matches the target power level.

    SYSTEMS AND METHODS FOR DETERMINING A SUSTAINED THERMAL POWER ENVELOPE COMPRISING MULTIPLE HEAT SOURCES

    公开(公告)号:US20170262030A1

    公开(公告)日:2017-09-14

    申请号:US15190181

    申请日:2016-06-23

    CPC classification number: G06F1/26 G06F1/3206 Y02D10/16

    Abstract: Various embodiments of systems and methods are disclosed for determining a thermal power envelope. One method comprises determining a set of component and operating point combinations for a plurality of components in a portable computing device. Each component and operating point combination in the set defines an available operating point for each of the plurality of components. The portable computing device is iteratively set to each of the component and operating point combinations in the set. At each of the component and operating point combinations, power consumption data and skin temperature data is collected from a plurality of temperature sensors. An enhanced thermal power envelope is generated comprising the power consumption data and the skin temperature data for each of the component and operating point combinations.

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