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公开(公告)号：US10376997B2
公开(公告)日：2019-08-13
申请号：US15631894
申请日：2017-06-23
摘要： Processes of joining substrates via transient liquid phase bonding (TLPB). The processes include providing an interlayer of a low melting temperature phase (LTP) that includes Sn and Bi between and in contact with at least two substrates, and heating the substrates and the interlayer therebetween at a processing temperature equal to or above 200° C. such that the interlayer liquefies and the LTP interacts with high melting temperature phases (HTPs) of the substrates to yield isothermal solidification of the interlayer. The processing temperature is maintained for a duration sufficient for the interlayer to be completely consumed and a solid bond is formed between the substrates. Also provided are assemblies formed by the above noted processes.
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公开(公告)号：US20170368644A1
公开(公告)日：2017-12-28
申请号：US15631894
申请日：2017-06-23
CPC分类号： B23K35/264 , B23K1/203 , B23K20/16 , H01L24/00 , H01L2224/83
摘要： Processes of joining substrates via transient liquid phase bonding (TLPB). The processes include providing an interlayer of a low melting temperature phase (LTP) that includes Sn and Bi between and in contact with at least two substrates, and heating the substrates and the interlayer therebetween at a processing temperature equal to or above 200° C. such that the interlayer liquefies and the LTP interacts with high melting temperature phases (HTPs) of the substrates to yield isothermal solidification of the interlayer. The processing temperature is maintained for a duration sufficient for the interlayer to be completely consumed and a solid bond is formed between the substrates. Also provided are assemblies formed by the above noted processes.
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