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公开(公告)号:US20230302560A1
公开(公告)日:2023-09-28
申请号:US18123732
申请日:2023-03-20
摘要: A die cleaning device includes a device body comprising a chassis; a plate assembly movably mounted to the device body and comprising a cleaning plate, the cleaning plate configured to engage a die slot of a die and dislodge excess material trapped within the die slot; a lift mechanism configured to move the cleaning plate relative to the chassis between at least a lowered position and a raised position, wherein, in the lowered position, the cleaning plate is disengaged from the die slot, and in the raised position, the cleaning plate engages the die slot; and a drive mechanism configured to laterally move the cleaning plate relative to the chassis within the die slot.