DIE CLEANING DEVICE
    1.
    发明公开
    DIE CLEANING DEVICE 审中-公开

    公开(公告)号:US20230302560A1

    公开(公告)日:2023-09-28

    申请号:US18123732

    申请日:2023-03-20

    IPC分类号: B23G5/04 B23G9/00

    CPC分类号: B23G5/04 B23G9/009

    摘要: A die cleaning device includes a device body comprising a chassis; a plate assembly movably mounted to the device body and comprising a cleaning plate, the cleaning plate configured to engage a die slot of a die and dislodge excess material trapped within the die slot; a lift mechanism configured to move the cleaning plate relative to the chassis between at least a lowered position and a raised position, wherein, in the lowered position, the cleaning plate is disengaged from the die slot, and in the raised position, the cleaning plate engages the die slot; and a drive mechanism configured to laterally move the cleaning plate relative to the chassis within the die slot.