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1.发明申请公开(公告)号：US20230054960A1
公开(公告)日：2023-02-23
申请号：US17797375
申请日：2021-01-29
Inventor： Yusuke FUKAMOTO , Yasushi YAMADA , Yasuaki MAEDA
Abstract: A side-filling resin composition is used to form a side-filling member to be interposed between a base member and a peripheral edge portion of a surface, facing the base member, of a mounted component that is surface-mounted on the base member. The side-filling resin composition has photocurability.
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