公开(公告)号：US20160178186A1

公开(公告)日：2016-06-23

申请号：US14893146

申请日：2014-05-26

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Tomokazu KUSUNOKI ,  Hiroyoshi YODEN ,  Yuki KOTANI ,  Ryusuke KOTERA

IPC: F21V29/87 ,  F21V29/89 ,  H01L33/64 ,  H01L33/48 ,  H01L33/56 ,  F21K99/00 ,  F21V29/70

CPC classification number: F21V29/87 ,  F21K9/00 ,  F21K9/20 ,  F21V19/0055 ,  F21V23/06 ,  F21V29/70 ,  F21V29/85 ,  F21V29/89 ,  F21Y2115/10 ,  H01L33/483 ,  H01L33/56 ,  H01L33/644

Abstract: An LED unit (100) includes a base unit (1). The LED unit further includes a light emitting device (3) including: a package substrate (3b); and a light emitting portion (3a) provided in the package substrate and having LED chips, the light emitting device being placed on a front surface of the base unit. The base unit is formed of a molding in which a metal member (11) is covered with thermally conductive resin having an electrical insulation property, and the thermally conductive resin is interposed between the light emitting device and the metal member. The LED unit can thus efficiently radiate heat generated in the light emitting device through the base unit toward a fixture to which the LED unit is attached.

Abstract translation: LED单元（100）包括基座单元（1）。 LED单元还包括发光器件（3），包括：封装衬底（3b）; 以及设置在所述封装基板中并且具有LED芯片的发光部分（3a），所述发光器件被放置在所述基座单元的前表面上。 基体单元由金属构件（11）被具有电绝缘性的导热性树脂覆盖的成型体形成，并且导热性树脂介于发光元件与金属构件之间。 因此，LED单元可以有效地将发光装置中产生的热量通过基座单元朝向与LED单元相连的固定装置发射。

公开(公告)号：US20240126935A1

公开(公告)日：2024-04-18

申请号：US18264027

申请日：2021-12-24

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Youji URANO ,  Yoshinori NISHIMURA ,  Tomokazu KUSUNOKI ,  Kazuo NISHIMURA ,  Ken UENO ,  Tomohiro NAKATANI

IPC: G06F30/13

CPC classification number: G06F30/13

Abstract: A data processing system according to the present disclosure includes an acquisition unit and a production unit. The acquisition unit acquires on-site investigation data related to the space. The production unit changes, with respect to article data of the article to be placed in the space, at least one of a dimension, design, and a function on the basis of the on-site investigation data so as to achieve harmony with the space and produces article processing data for processing the article according to the article data after the change. The on-site investigation data includes space-related data related to the space. The production unit produces the article processing data on the basis of the space-related data.

公开(公告)号：US20210087667A1

公开(公告)日：2021-03-25

申请号：US16970372

申请日：2019-03-28

Applicant: Panasonic Intellectual Property Management CO., Ltd.

Inventor： Tomokazu KUSUNOKI ,  Kanji SAKURAGI ,  Shinji FUJIMOTO ,  Koichi MASUKAWA

IPC: C23C4/11 ,  C08K3/22 ,  C23C4/02

Abstract: A resin molded body includes a resin structure, an intermediate layer including an inorganic filler and an organic resin binder and provided on a surface of at least a part of the resin structure, and a thermal sprayed ceramic coating provided on the intermediate layer. The inorganic filler is amorphous in shape and has a central particle diameter of 20 μm or more and 100 μm or less. The intermediate layer has a thickness of 50 μm or more and 250 μm or less. The central particle diameter a of the inorganic filler and the thickness b of the intermediate layer satisfy the relationship of b≥2a, and the inorganic filler is contained in the intermediate layer in an amount of 40% to 65% as a volume ratio.