公开(公告)号：US20170263525A1

公开(公告)日：2017-09-14

申请号：US15426341

申请日：2017-02-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： BUNZI MIZUNO ,  SHOGO OKITA ,  MITSURU HIROSHIMA ,  TUTOMU SAKURAI ,  NORIYUKI MATSUBARA

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/311 ,  H01L23/544 ,  H01L21/268 ,  H01L21/78

CPC classification number: H01L23/3192 ,  H01L21/268 ,  H01L21/31116 ,  H01L21/56 ,  H01L21/6836 ,  H01L21/78 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68318 ,  H01L2221/68327 ,  H01L2221/68381

Abstract: A method of manufacturing an element chip includes an isotropic etching step of removing the first damaged region and the second damaged region through etching the first layer isotropically by exposing the substrate to first plasma after the laser scribing step. The method of manufacturing an element chip further includes a plasma, dicing step of dividing the substrate to a plurality of element chips including the element region through etching the first layer anisotropically by exposing the substrate to second plasma in a state where the second main surface is supported by a supporting member, after the isotropic etching step.

公开(公告)号：US20170263500A1

公开(公告)日：2017-09-14

申请号：US15426199

申请日：2017-02-07

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： BUNZI MIZUNO ,  SHOGO OKITA ,  MITSURU HIROSHIMA ,  TUTOMU SAKURAI ,  NORIYUKI MATSUBARA

IPC: H01L21/78 ,  H01L21/67

CPC classification number: H01L21/78 ,  H01J2237/334 ,  H01L21/268 ,  H01L21/3065 ,  H01L21/30655 ,  H01L21/31116 ,  H01L21/67069 ,  H01L21/67109 ,  H01L21/67115 ,  H01L21/6831

Abstract: The method includes a laser scribing step of forming an opening including an exposing portion, where the first layer is exposed, by irradiating the dividing region of the substrate with laser light from the first main surface side, forming a remaining region on which the second layer in the dividing region remains around the opening other than the exposing portion, and forming a first damaged region of a surface layer portion of the first layer including the exposing portion and a second damaged region of a surface layer portion of the first layer to be covered by the remaining region on the first layer of the dividing region.