公开(公告)号：US20210366817A1

公开(公告)日：2021-11-25

申请号：US17238286

申请日：2021-04-23

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： TAKERU TAMARI ,  DAISUKE SAKURAI ,  KIYOKAZU ITOI

IPC: H01L23/498 ,  G01B7/16 ,  H01L23/48 ,  H01L21/48

Abstract: A semiconductor device includes: a first board that has a first end surface and a second end surface opposite to the first end surface; a second board that is attached to the second end surface of the first board; a plurality of first electrodes that are provided on the first end surface; a second electrode that is provided on the second end surface and electrically coupled to an electrode of the second board; an internal wiring that is provided inside the first board and electrically coupled to the second electrode; a plurality of third electrodes that are provided inside the first board and electrically couple the first electrodes to the internal wiring; and a strain sensor that is provided inside the first board and measures a strain generated in the first board, in which a linear expansion coefficient of each of the third electrodes is larger than a linear expansion coefficient of the first board.