公开(公告)号：US12284452B2

公开(公告)日：2025-04-22

申请号：US17777484

申请日：2020-09-16

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Ryota Sudo ,  Nayuta Minami ,  Nobuaki Shimamoto ,  Naoki Kobayashi ,  Shoya Kida

IPC: H04N25/50 ,  G01J5/00 ,  G06V40/10 ,  H04N23/11

Abstract: An infrared processing system includes a first thermal image generating unit, an object extracting unit, a second thermal image generating unit, and an object temperature calculating unit. The first thermal image generating unit generates, using a first temperature correction value, a first thermal image based on the output signal of the image sensor. The object extracting unit extracts the object from the first thermal image. The second thermal image generating unit generates, using a second temperature correction value corresponding to the object that has been extracted by the object extracting unit, a second thermal image based on the output signal of the image sensor. The object temperature calculating unit calculates, based on the second thermal image that has been generated by the second thermal image generating unit, a temperature of the object that has been extracted by the object extracting unit.

公开(公告)号：US10534013B2

公开(公告)日：2020-01-14

申请号：US15526333

申请日：2016-01-08

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Yuki Maegawa ,  Hideki Ueda ,  Hideaki Fujiura ,  Takeshi Uemura ,  Hiroshi Nakatsuka ,  Tsuyoshi Sakaue ,  Rie Okamoto ,  Shoya Kida

IPC: H05K5/00 ,  G01P1/02 ,  G01P15/125 ,  H05K5/02 ,  H05K5/03

Abstract: A sensor includes a sensor element, a package accommodating the sensor element in an inside of the package, a grounding electrode disposed in the package, a lid covering an opening of the package, and a lead extending from the package. The lead includes first and second portions. The first portion of the lead is electrically connected to the grounding electrode and extends along a side surface of the package with a gap provided between the first portion and the side surface. The second portion of the lead is disposed between the lid and the package and extends toward the inside of the package. In this sensor, the opening can be sealed without soldering and reliably connect the lid to the grounding electrode.