公开(公告)号：US12240061B2

公开(公告)日：2025-03-04

申请号：US17911770

申请日：2021-03-03

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shohei Sanada ,  Shigeru Yamatsu

IPC: B23K35/00 ,  B23K35/36 ,  B23K35/362 ,  C08G59/22 ,  C08G59/24 ,  C08G59/32 ,  C08G59/38 ,  C08G59/50 ,  C08G59/68 ,  C08K5/1575 ,  C08K5/20 ,  H05K1/18 ,  B23K101/38

Abstract: A flux resin composition includes an epoxy resin, an imidazole compound, a thixo agent, and an activator. The epoxy resin includes at least one resin selected from the group consisting of naphthalene epoxy resins, biphenyl aralkyl epoxy resins, trisphenol methane epoxy resins, biphenyl epoxy resins, and dicyclopentadiene epoxy resins. The content of the at least one resin is equal to or greater than 20% by weight with respect to a total weight of the epoxy resin.

公开(公告)号：US12269945B2

公开(公告)日：2025-04-08

申请号：US17551758

申请日：2021-12-15

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Shohei Sanada ,  Shigeru Yamatsu

IPC: C08L63/04 ,  H05K1/18 ,  H05K3/34

Abstract: A flux resin composition contains: 60-80% by weight of an epoxy resin; 0.01-2% by weight of an imidazole compound; 1-5% by weight of a thixo agent; 4-20% by weight of an activator; and 7-30% by weight of a phenolic compound. The epoxy resin contains at least one resin selected from the group consisting of naphthalene type epoxy resins, biphenyl aralkyl type epoxy resins, trisphenol methane type epoxy resins, biphenyl type epoxy resins, and dicyclopentadiene type epoxy resins. Content of the at least one resin falls within a range from 15% by weight to 40% by weight with respect to a total weight of the flux resin composition. The phenolic resin is liquid and contains a phenol novolac.