公开(公告)号：US12021015B2

公开(公告)日：2024-06-25

申请号：US16275957

申请日：2019-02-14

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Hiroki Tamiya ,  Koji Kishino ,  Ryuji Takahashi ,  Yasunori Hoshino ,  Takahiro Yamada ,  Shimpei Obata ,  Hiroyuki Shiraki ,  Shinya Arakawa ,  Shigetoshi Fujita

IPC: H01L23/498 ,  C08K9/04 ,  H01L23/14

CPC classification number: H01L23/49827 ,  C08K9/04 ,  H01L23/145 ,  C08L2203/20 ,  C08L2207/53 ,  H01L2224/16225 ,  C08K9/04 ,  C08L63/00

Abstract: A thermosetting resin composition according to the invention contains: a thermosetting resin component; and silica having an average particle diameter equal to or greater than 0.2 μm and treated with isocyanate. It is preferable that the content of the silica is in a range of 50% by mass to 300% by mass with respect to the thermosetting resin component. It is also preferable that the thermosetting resin composition contains core shell rubber having content in a range of 20% by mass to 80% by mass with respect to the thermosetting resin component.