公开(公告)号：US12289836B2

公开(公告)日：2025-04-29

申请号：US17637101

申请日：2020-06-09

Applicant: Panasonic Intellectual Property Management Co., Ltd.

Inventor： Syoichi Nishi ,  Hideki Sumi ,  Hiroshi Murata ,  Koji Sakurai ,  Kenichi Ichikawa

IPC: H05K13/00 ,  H05K13/08

Abstract: A method for manufacturing a mounting board includes a first outer shape position acquisition step, a feature portion position acquisition step, a calculation step, a holding step, a second outer shape position acquisition step, and a mounting step. In the first outer shape position acquisition step, a first outer shape position of a component is acquired. In the feature portion position acquisition step, a position of a feature portion is acquired. In the calculation step, a deviation amount of the position of the feature portion with respect to the first outer shape position is calculated. In the second outer shape position acquisition step, a second outer shape position of the component is acquired. In the mounting step, the feature portion of the component is mounted to be positioned on a target position of a board based on the second outer shape position and the deviation amount.