公开(公告)号：US20220017710A1

公开(公告)日：2022-01-20

申请号：US17298472

申请日：2019-03-26

申请人： PI Advanced Materials Co., Ltd.

发明人： Dong Young WON ,  Dong Young KIM ,  Sung Il CHO ,  Jeong Yeul CHOI

IPC分类号： C08J5/18 ,  C08G73/10 ,  C08K3/36 ,  C08K7/18

摘要： The present invention provides a polyimide film comprising inorganic fillers, the inorganic fillers comprising: a first filler group having a particle diameter (D50) falling within the range of 2-2.7 μm; and a second filler group having an average particle diameter (D50) falling within the range of 1-1.7 μm, wherein each of the first and second filler groups satisfies relational expression 1, 0.7≤(D90−D10)/(D50)≤1.2, with respect to the particle diameter.

公开(公告)号：US20220411585A1

公开(公告)日：2022-12-29

申请号：US17609565

申请日：2019-10-29

申请人： PI Advanced Materials Co., Ltd.

发明人： Dong Young KIM ,  Dong Young WON ,  Jeong Yeul CHOI

IPC分类号： C08G73/10 ,  C08K5/09 ,  C08J5/18

摘要： The present disclosure relates to a method for manufacturing a polyimide film and a polyimide film manufactured thereby. In one embodiment, the method for preparing a polyimide film includes: preparing a polyamic acid by polymerizing a mixture containing an aromatic diamine and an aromatic acid dianhydride; preparing a first composition containing the polyamic acid, an amine-based catalyst, an acid anhydride-based dehydrating agent, and a solvent; and forming a polyimide film at 150° C. or less using the first composition, wherein the first composition contains the amine-based catalyst and the acid anhydride-based dehydrating agent in a molar ratio of 1:2 to 1:5.

公开(公告)号：US20220009143A1

公开(公告)日：2022-01-13

申请号：US17292410

申请日：2019-11-08

申请人： PI Advanced Materials Co., Ltd.

发明人： Dong Young KIM ,  Dong Young WON ,  Jeong Yeul CHOI

IPC分类号： B29C48/18 ,  C08G73/10 ,  C08L79/08 ,  B29C48/91 ,  B29C71/02 ,  C23C14/20 ,  C08K3/08

摘要： A polyimide composite film having good adhesion to a metal layer without deterioration in mechanical properties.

公开(公告)号：US20230049631A1

公开(公告)日：2023-02-16

申请号：US17780373

申请日：2020-04-23

申请人： PI Advanced Materials Co., Ltd.

发明人： Dong Young WON ,  Dong Young KIM

IPC分类号： C08G73/10 ,  B32B27/28 ,  B32B15/08

摘要： A polyimide film, a method of manufacturing the same, and a flexible metal foil clad laminate including the same. The polyimide film includes: a first imide bond unit having a glass transition temperature of 400° C. or higher; and a second imide bond unit having a glass transition temperature of less than 400° C., wherein the first imide bond unit is present in an amount of about 39 mol% to about 90 mol% in the polyimide film.

公开(公告)号：US20220017711A1

公开(公告)日：2022-01-20

申请号：US17298484

申请日：2019-03-26

申请人： PI Advanced Materials Co., Ltd.

发明人： Dong Young WON ,  Dong Young KIM ,  Jeong Yeul CHOI

IPC分类号： C08J5/18 ,  C08G73/10 ,  C08K7/18

摘要： The present invention provides a polyimide film comprising an inorganic filler, which comprises a first filler group having a diameter (D50) of 2-2.7 μm and a second filler group having an average diameter (D50) of 1-1.7 μm, wherein the polyimide film satisfies relation 1: 0.7≤(D90−D10)/(D50)≤1.2, which is about the respective diameters of the first filler group and the second filler group.