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公开(公告)号:US10262918B1
公开(公告)日:2019-04-16
申请号:US14757755
申请日:2015-12-23
发明人: Irfan Bhatti
IPC分类号: H01L23/40 , H01L23/467 , H01L23/367
摘要: A heat transfer cooling module is described. One embodiment of the module has a plate attached to a bracket. A tower is affixed the plate. One end of the tower can be in contact with the heat source. The opposite end of the tower has a radiator attached which dissipates the heat that travels from the first end of the tower to the opposite end of the tower. Both the tower and the radiator are made from efficient materials for the transfer of heat. Another embodiment of the heat transfer cooling module is shown where the device is in two pieces, the first a fin module affixed to a bracket. The heat source is in contact with a base of the fin module where the heat travels through the base, to the fins where it dissipates to ambient.