公开(公告)号：US20220139797A1

公开(公告)日：2022-05-05

申请号：US17431657

申请日：2020-01-14

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koji TAKAHASHI ,  Kazuhiro YAHATA ,  Yoshihisa MINAMI ,  Hiroki AKASHI ,  Shinya MIYAZAKI

IPC: H01L23/367 ,  H01L23/00 ,  H01L25/065

Abstract: The semiconductor module includes: a heat dissipation board including first to third wiring patterns; a first metal plate on the first wiring pattern, a second metal plate on the second wiring pattern, a first semiconductor chip and a first intermediate board which are on the first metal plate, a second semiconductor chip and a second intermediate board which are on the second metal plate. A first metal film on the first intermediate board is electrically connected to the first semiconductor chip and the second metal plate, and a second metal film on the second intermediate board is electrically connected to the second semiconductor chip and the third wiring pattern.