公开(公告)号：US11885621B2

公开(公告)日：2024-01-30

申请号：US17415340

申请日：2020-02-04

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Koichiro Nakashima ,  Takashi Uchida ,  Yusuke Nakamura ,  Hideki Ueda ,  Naruhito Noda ,  Toshitsugu Konishi ,  Toshio Yamazaki

IPC: G01C19/5783 ,  B81B7/00 ,  G01C19/5684

CPC classification number: G01C19/5783 ,  B81B7/007 ,  B81B7/0048 ,  G01C19/5684 ,  B81B2201/0242

Abstract: A sensor device includes a sensor element, a substrate, and a bonding wire. Over the substrate, provided is the sensor element. The bonding wire forms at least part of a connection path that electrically connects the sensor element and the substrate together. The bonding wire is provided to connect two connection surfaces that intersect with each other.