公开(公告)号：US20200059620A1

公开(公告)日：2020-02-20

申请号：US16661854

申请日：2019-10-23

Applicant: PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.

Inventor： Yuusuke SHIMIZU ,  Kazutoshi ONOZAWA

IPC: H04N5/369 ,  H01L27/146 ,  H04N5/3745 ,  H01L25/065 ,  H01L23/498

Abstract: A solid-state image capture device includes a first semiconductor substrate and a second semiconductor substrate. The first semiconductor substrate includes a first connection and a pixel array in which a plurality of pixels are arranged in a matrix. The second semiconductor substrate includes a second connection and a pad area including a plurality of pad electrodes for electrical connection with external equipment. The second semiconductor substrate controls the pixel array. The first and second semiconductor substrates are stacked and joined together, with the first and second connections electrically connected to each other. The first and second semiconductor substrates are substantially equal in size, and the pad electrodes are included in only the second semiconductor substrate.