公开(公告)号：US20240282789A1

公开(公告)日：2024-08-22

申请号：US18171805

申请日：2023-02-21

Applicant: OmniVision Technologies, Inc.

Inventor： Xiaowei Wang ,  Yin Qian ,  Zhiqiang Lin ,  Lindsay Grant

IPC: H01L27/146

CPC classification number: H01L27/14618 ,  H01L27/1462 ,  H01L27/14627

Abstract: An image sensor comprises an image sensor chip comprising a semiconductor substrate having a top surface and a plurality of microlenses disposed on the top surface; a cover glass having a first side in contact with air and a second side opposite to the first side; and a multi-layer structure disposed between the plurality of microlenses and the cover glass, which comprises: a bottom layer directly in contact with the plurality of microlenses, where the refractive index of the bottom layer is lower than the refractive index of the plurality of microlenses, and a top layer directly in contact with the second side of the cover glass, where the top layer is an optical glue made for bonding two optical elements.