公开(公告)号：US12287464B2

公开(公告)日：2025-04-29

申请号：US18086522

申请日：2022-12-21

Applicant: OmniVision Technologies, Inc.

Inventor： Kuang-Ju Wang ,  Jau-Jan Deng ,  I-Lung Lu

IPC: G02B13/00 ,  G02B13/06 ,  H01L27/146 ,  H04N23/55 ,  G02B9/12 ,  G03B9/02

Abstract: A chip-level camera includes an image sensor; a concave L1 lens element on an inside surface of a first substrate; a convex L2 lens element on a first surface of a second substrate; a diaphragm stop on a second surface of the second substrate or on a first surface of a third substrate, the diaphragm stop between the second and third substrates; a convex L3 lens element on a second surface of the third substrate spaced from the image sensor; a first spacer holding first substrate at a predetermined distance from the second substrate; and a second spacer holding the second substrate a predetermined distance from the image sensor. In embodiments, lens element L1 has concave aspheric radius of R1, and lens L2 convex aspheric radius of R2, such that 1.3