公开(公告)号：US11583171B2

公开(公告)日：2023-02-21

申请号：US16548753

申请日：2019-08-22

Applicant: OmniVision Technologies, Inc.

Inventor： Teng-Sheng Chen ,  Chien-Chan Yeh ,  Cheng-Fang Chiu ,  Wei-Feng Lin

IPC: H05K1/11 ,  H05K3/46 ,  A61B1/005

Abstract: A surface-mount device platform includes a surface-mounting region, a connection region, and a bendable region therebetween, each including a respective part of a base substrate. The base substrate includes electrically-conductive layers interspersed with electrically-insulating build-up layers. Each of the surface-mounting region, the connection region, and the bendable region spans between a bottom substrate-surface and a top substrate-surface of the base substrate. The surface-mounting region further includes an electrically-insulating first top rigid-layer, and device bond-pads exposed on a top surface of the first top rigid-layer facing away from the top substrate-surface in the surface-mounting region. The connection region further includes an electrically-insulating second top rigid-layer and a plurality of connector bond-pads each exposed on a top surface of the second top rigid-layer facing away from the top substrate-surface in the connection region, and electrically connected to a respective device bond-pad via at least one of the electrically conductive layers.