公开(公告)号：US10372059B2

公开(公告)日：2019-08-06

申请号：US15787890

申请日：2017-10-19

Applicant: Oki Data Corporation

Inventor： Taishi Kaneto

IPC: G03G15/04 ,  G02B3/00 ,  G03G15/043

Abstract: A lens unit according to an embodiment includes: a lens array that includes lens elements each provided with an optical axis and extends in a first direction; a support member that supports the lens array; and an adhesive that bonds the lens array and the support member. The support member includes a first adhesive holding portion with a specified depth in a direction of the optical axis and a second adhesive holding portion shallower than the first adhesive holding portion. The first adhesive holding portion and the second adhesive holding portion are aligned in the first direction. The adhesive is arranged at the first adhesive holding portion and the second adhesive holding portion.

公开(公告)号：US09614125B2

公开(公告)日：2017-04-04

申请号：US14673771

申请日：2015-03-30

Applicant: Oki Data Corporation

Inventor： Taishi Kaneto ,  Takahito Suzuki

IPC: G03G15/04 ,  H01L33/24 ,  H01L25/075 ,  H01L25/16 ,  B41J2/45 ,  H01L27/15

CPC classification number: H01L33/24 ,  B41J2/45 ,  G03G15/04054 ,  H01L25/0753 ,  H01L25/167 ,  H01L27/156 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A composite element chip includes a substrate; and a plurality of semiconductor thin-films disposed on the substrate and arranged in a predetermined direction which is a first direction. Each semiconductor thin-film includes an array of a plurality of light emitting portions which are arranged so that adjacent light emitting portions are displaced from each other by a predetermined distance in a second direction which is perpendicular to the first direction, the plurality of light emitting portions being arranged along an imaginary line. Each semiconductor thin-film has a first end that is parallel to the second direction; and a second end that extends along a pattern in which the plurality of light emitting portions are arranged and is parallel to the imaginary line. A semiconductor device and manufacturing method thereof, a printing head, and an image forming apparatus are also disclosed.

公开(公告)号：US09429867B2

公开(公告)日：2016-08-30

申请号：US14669723

申请日：2015-03-26

Applicant: Oki Data Corporation

Inventor： Takahito Suzuki ,  Taishi Kaneto

IPC: G03G15/04 ,  G03G15/043 ,  F21V23/06 ,  F21V21/00 ,  F21Y103/00

CPC classification number: G03G15/043 ,  F21V21/00 ,  F21V23/06 ,  F21Y2103/10 ,  G03G15/04054 ,  H01L27/153 ,  H01L33/20

Abstract: A semiconductor apparatus includes a rectangular plate-like body including a major surface. A plurality of light emitting portions formed in the major surface, and aligned in a straight line. A first terraced portion and a second terraced portion are formed in the major surface except areas in which the plurality of light emitting portions are formed.

Abstract translation: 半导体装置包括具有主表面的矩形板状主体。 多个发光部分形成在主表面上并且以直线对准。 除了形成多个发光部的区域之外，在主表面上形成第一台阶部分和第二台阶部分。

公开(公告)号：US09696649B2

公开(公告)日：2017-07-04

申请号：US15071349

申请日：2016-03-16

Applicant: Oki Data Corporation

Inventor： Taishi Kaneto

IPC: G03G15/04 ,  G03G15/043 ,  G03G21/20

CPC classification number: G03G15/04036 ,  G03G15/0435 ,  G03G21/20

Abstract: An optical head includes a lens array including resin lenses, a holder that holds the lens array, and a positioning mechanism that positions the holder such that the holder is opposed to a target. The positioning mechanism is configured to change a distance between the lens array and the target depending on a change in at least any one of temperature and humidity.

公开(公告)号：US09178115B2

公开(公告)日：2015-11-03

申请号：US13762719

申请日：2013-02-08

Applicant: Oki Data Corporation

Inventor： Takahito Suzuki ,  Taishi Kaneto ,  Satoshi Tanaka ,  Kenichi Tanigawa

IPC: G09G5/10 ,  H01L33/36 ,  H01L25/075 ,  H01L33/62

CPC classification number: H01L33/36 ,  H01L24/24 ,  H01L25/0753 ,  H01L33/62 ,  H01L2224/32245 ,  H01L2224/32257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48464 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: A semiconductor light emitting apparatus includes a substrate. A plurality of first electrode wirings are formed on the surface of the substrate. At least one second electrode wiring is formed on the surface of the substrate. A light emitting section is connected between a corresponding one of the plurality of first electrode wirings and the at least one second electrode wiring. The light emitting section includes a plurality of light emitting elements.

Abstract translation: 半导体发光装置包括基板。 多个第一电极布线形成在基板的表面上。 在基板的表面上形成至少一个第二电极布线。 发光部分连接在所述多个第一电极布线和所述至少一个第二电极布线中的对应的一个之间。 发光部分包括多个发光元件。