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1.发明申请公开(公告)号：US20220077361A1
公开(公告)日：2022-03-10
申请号：US17430283
申请日：2019-04-12
发明人： Ee Lian Lee , Boon Liang Yap , Prakash Rajah
摘要： In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.
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2.发明授权公开(公告)号：US12095013B2
公开(公告)日：2024-09-17
申请号：US17430283
申请日：2019-04-12
发明人： Ee Lian Lee , Boon Liang Yap , Prakash Rajah
CPC分类号： H01L33/58 , H01L33/005 , H01L33/54 , H01L2933/005 , H01L2933/0058
摘要： In an embodiment a method for producing a plurality of radiation-emitting devices includes providing a plurality of semiconductor chips on a main surface of a carrier, each semiconductor chip for emitting electromagnetic radiation from a radiation exit surface, arranging a lens mold with a plurality of cavities over the carrier, introducing a liquid mold material into the cavities of the lens mold and curing the liquid mold material such that a plurality of molded lenses is generated, wherein the molded lenses directly adjoin the main surface of the carrier, wherein regions of an outer surface of the molded lenses directly adjacent to the main surface of the carrier are free of planar areas, and wherein the carrier includes a plurality of carrier elements, the carrier elements having a first recess in a main surface extending from a side face of the carrier element.
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