公开(公告)号：US11480471B2

公开(公告)日：2022-10-25

申请号：US17129074

申请日：2020-12-21

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Jenping Ku ,  Chein-Hsun Wang ,  Chein-Hsing Yu ,  Wen-Chang Yu

IPC: G01J5/10 ,  G01K15/00 ,  G01K1/20

Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.

公开(公告)号：US20220113203A1

公开(公告)日：2022-04-14

申请号：US17129074

申请日：2020-12-21

Applicant: ORIENTAL SYSTEM TECHNOLOGY INC.

Inventor： Jenping Ku ,  Chein-Hsun Wang ,  Chein-Hsing Yu ,  Wen-Chang Yu

IPC: G01K15/00 ,  G01J5/10 ,  G01K1/20

Abstract: An infrared temperature sensor comprises a first communication port and a second communication port. A plurality of infrared temperature sensors can be cascaded to each other and connected to an external host controller through the second communication port. The external host controller can set up and administer the unique addresses of the plurality of the infrared temperature sensors through the second communication port, whereby to selectively perform multicasting communication or unicasting communication with the plurality of infrared temperature sensors through the first communication port. The infrared temperature sensor further comprises a second thermopile sensing element used to sense the thermal radiation of a package structure, whereby to compensate for the measurement error induced by temperature variation of the package structure. Thus, the measurement accuracy is increased.