公开(公告)号：US20220178987A1

公开(公告)日：2022-06-09

申请号：US17601086

申请日：2020-03-27

Applicant: NIDEC READ CORPORATION

Inventor： Minoru KATO ,  Makoto FUJINO

IPC: G01R31/28 ,  G01R1/073 ,  G01R1/067

Abstract: In various examples, an inspection jig includes a plate-shaped insulating member having a recess; a first board having a first electrode; and a conducting wire electrically connected to a contact terminal. The insulating member is provided with a through hole penetrating a bottom portion of the recess. One end portion of the conducting wire is disposed in the through hole. The other end of the conducting wire is connected to the first electrode.

公开(公告)号：US20150310161A1

公开(公告)日：2015-10-29

申请号：US14693134

申请日：2015-04-22

Applicant: NIDEC-READ CORPORATION

Inventor： Michio KAIDA ,  Toshihide MATSUKAWA ,  Makoto FUJINO ,  Osamu HIKITA

IPC: G06F17/50

CPC classification number: G06F17/5086

Abstract: Provided is a method of designing a circuit board inspecting jig having a contact to be brought into conductive contact with a test point on a circuit board to be inspected. The method includes: preparing temporary design data by temporarily designing the circuit board inspecting jig based on design data for the circuit board to be inspected (a first designing process); acquiring an expansion and contraction ratio of the circuit board based on a condition upon manufacturing the circuit board (and an environmental condition upon inspecting the circuit board) (an expansion and contraction ratio acquiring process); and obtaining design data for the circuit board inspecting jig to be actually manufactured by scaling the temporary design data up and down by the expansion and contraction ratio (a second designing process).

Abstract translation: 提供一种设计电路板检查夹具的方法，该夹具具有与要检查的电路板上的测试点导电接触的触点。 该方法包括：基于要检查的电路板的设计数据临时设计电路板检查夹具（第一设计过程），准备临时设计数据; 根据制造电路板的条件（以及检查电路板的环境条件）（扩张和收缩比率获取过程）获得电路板的膨胀和收缩比; 并通过缩小比例（第二设计过程）来获取实际制造的电路板检查夹具的设计数据。

公开(公告)号：US20200041543A1

公开(公告)日：2020-02-06

申请号：US16495842

申请日：2018-03-14

Applicant: Nidec-Read Corporation

Inventor： Michihisa MAEDA ,  Kiyoshi NUMATA ,  Hidekazu YAMAZAKI ,  Makoto FUJINO

IPC: G01R1/067 ,  B82Y40/00 ,  C01B32/166 ,  C01B32/162

Abstract: A probe structure is provided with: a holding plate which has a first surface and a second surface in which at least the first surface is insulated; a plurality of electrodes which are formed on the first surface of the holding plate in such a state that the plurality of electrodes is separated from each other; and carbon nanotube structures which are erected on the electrodes 3. The holding plate is provided with through holes which correspond to the electrodes, respectively.