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公开(公告)号：US20220267624A1
公开(公告)日：2022-08-25
申请号：US17620860
申请日：2020-06-19
发明人： Alik Belitzky
IPC分类号： C09D11/102 , B29C64/209 , C09D11/106 , C09D11/101 , C09D11/38 , C08F2/50 , B29C64/112
摘要： The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.
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公开(公告)号：US20220203606A1
公开(公告)日：2022-06-30
申请号：US17622776
申请日：2020-06-26
发明人： Alik Belitzky
IPC分类号： B29C64/112 , B29C64/393 , B33Y10/00 , B33Y50/02 , B33Y70/00 , B29C64/40 , C09D11/52 , C09D11/101
摘要： The disclosure relates to systems, methods and compositions for fabricating composite component using additive manufacturing (AM). Specifically, the disclosure is directed to methods, systems and compositions for the fabrication of composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.
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公开(公告)号：US11629261B2
公开(公告)日：2023-04-18
申请号：US17620860
申请日：2020-06-19
发明人： Alik Belitzky
IPC分类号： C09D11/102 , C08F2/50 , C09D11/101 , B33Y10/00 , B29C64/112 , B29C64/209 , C09D11/106 , C09D11/38 , B33Y30/00 , B33Y70/00
摘要： The disclosure relates to systems, methods and compositions for fabricating additive manufactured electronics having conductive and dielectric constituents comprising voids, using additive manufacturing. Specifically, the disclosure is directed to the fabrication of three-dimensional component having conductive and dielectric constituents comprising voids by using water soluble support ink, capable of undergoing all processing steps for fabricating the dielectric and conductive constituents.
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公开(公告)号：US11446858B2
公开(公告)日：2022-09-20
申请号：US17622776
申请日：2020-06-26
发明人： Alik Belitzky
IPC分类号： B29C64/112 , B29C64/393 , B33Y10/00 , B33Y50/02 , B29C64/40 , C09D11/52 , C09D11/101 , B33Y70/00 , B29K309/02
摘要： The disclosure relates to systems, methods and compositions for fabricating composite component using additive manufacturing (AM). Specifically, the disclosure is directed to methods, systems and compositions for the fabrication of composite components having improved or modulated thermo-mechanical properties, as well as derivative dielectric strength, using for example, inkjet printing.
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