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公开(公告)号：US12015108B2
公开(公告)日：2024-06-18
申请号：US17261035
申请日：2019-04-29
发明人： Hailin Wang , Yunjian Lan , Xiangpeng Du
IPC分类号： H01L33/56 , C09K11/54 , H01L33/44 , H10K50/115 , H10K85/10 , B82Y20/00 , B82Y30/00 , B82Y40/00
CPC分类号： H01L33/56 , C09K11/54 , H01L33/44 , H10K85/10 , B82Y20/00 , B82Y30/00 , B82Y40/00 , H01L2933/005 , H10K50/115
摘要： The disclosure provides a light emitting device and a manufacturing method thereof. The light emitting device includes a substrate, an LED chip, a quantum dot composite layer and a first protective layer; the LED chip is disposed on a surface of the substrate; the quantum dot composite layer is arranged on a surface of the LED chip away from the substrate; the first protective layer is arranged on a surface of the quantum dot composite layer away from the LED chip; wherein the quantum dot composite layer includes a water-soluble polymer matrix and quantum dots dispersed in the water-soluble polymer matrix; the material of the first protective layer is one of a first inorganic oxide and a first water-blocking polymer; and the material of the water-soluble polymer matrix is an oxygen-blocking polymer.
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公开(公告)号：US12040426B2
公开(公告)日：2024-07-16
申请号：US17280869
申请日：2019-09-20
发明人： Yongyin Kang , Xiangpeng Du , Hailin Wang , Jianhai Zhou , Yunjian Lan
CPC分类号： H01L33/0093 , H01L33/507 , H01L33/56 , H01L33/641 , H01L2933/0041 , H01L2933/005
摘要： This present disclosure provides a manufacturing process of light emitting device and a light emitting device. The manufacturing process of light emitting device includes: step S1, making a quantum dot film; step S2, providing a LED unit, the LED unit including at least one LED chip; step S3, disposing a first transparent adhesive layer on an exposed surface of each LED chip; step S4, disposing the quantum dot film on the surface of the first transparent adhesive layer far away from the LED chip.
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