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公开(公告)号：US20220149006A1
公开(公告)日：2022-05-12
申请号：US17152806
申请日：2021-01-20
Applicant: NOVATEK Microelectronics Corp.
Inventor： Chien-Chen KO , Teng-Jui YU , Wei-Kang TSAI
IPC: H01L25/065 , H01L23/544 , H01L23/528
Abstract: A package structure includes a first chip and a second chip. The first chip is connected to a pair of first signal lines and a plurality of first power lines. The second chip is connected to a pair of second signal lines and a plurality of second power lines. The first chip and the second chip belong to a common wafer. A separated street is between the first chip and the second chip.
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