公开(公告)号：US11823635B2

公开(公告)日：2023-11-21

申请号：US17467443

申请日：2021-09-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Chun-Fu Lin ,  Hsing-Kuo Chao ,  Jhih-Siou Cheng ,  Ju-Lin Huang ,  Wen-Hsin Cheng

IPC: G09G3/30 ,  G09G3/34 ,  G02F1/1335 ,  G02F1/13357

CPC classification number: G09G3/3426 ,  G02F1/133603 ,  G02F1/133612 ,  G02F1/133628 ,  G09G2300/0408

Abstract: An LED backlight driver includes at least one driving chip configured to drive a backlight module. The at least one driving chip is disposed on at least one chip-on-film package, and not in direct contact with the backlight module to reduce heat transfer to the backlight module.

公开(公告)号：US20220122552A1

公开(公告)日：2022-04-21

申请号：US17467443

申请日：2021-09-06

Applicant: NOVATEK Microelectronics Corp.

Inventor： Chun-Fu Lin ,  Hsing-Kuo Chao ,  Jhih-Siou Cheng ,  Ju-Lin Huang ,  Wen-Hsin Cheng

IPC: G09G3/34 ,  G02F1/1335 ,  G02F1/13357

Abstract: An LED backlight driver includes at least one driving chip configured to drive a backlight module. The at least one driving chip is disposed on at least one chip-on-film package, and not in direct contact with the backlight module to reduce heat transfer to the backlight module.