公开(公告)号：US20210185826A1

公开(公告)日：2021-06-17

申请号：US17265922

申请日：2019-07-12

Applicant: NITTO DENKO CORPORATION

Inventor： Takuya TANIUCHI ,  Ryohei KAKIUCHI ,  Naoki SHIBATA ,  Yasunari OYABU

IPC: H05K3/06 ,  H05K1/02

Abstract: A wiring circuit board assembly sheet is partitioned by a product region in which a plurality of wiring circuit boards serving as products are disposed in alignment and a margin region surrounding the product region with the margin region having a first area adjacent to the product region and a second area located at the opposite side of the product region with respect to the first area. The wiring circuit board assembly sheet includes a dummy wiring circuit board disposed in at least a portion of the first area and smaller than the wiring circuit board.

公开(公告)号：US20210204402A1

公开(公告)日：2021-07-01

申请号：US17058513

申请日：2019-05-10

Applicant: NITTO DENKO CORPORATION

Inventor： Takuya TANIUCHI ,  Naoki SHIBATA ,  Ryosuke SASAOKA ,  Yasunari OYABU

IPC: H05K1/02 ,  H05K3/06

Abstract: A wiring circuit board assembly sheet includes a support sheet having two end edges parallel with each other and a plurality of wiring circuit boards disposed at spaced intervals to each other in the support sheet. The wiring circuit board includes a metal-based portion having a generally rectangular frame shape. The metal-based portion includes a first piece along a first direction perpendicular to a thickness direction of the support sheet, and a second piece along a second direction perpendicular to the thickness direction and the first direction. Both the first piece and the second piece are inclined with respect to the end edge of the support sheet.