公开(公告)号：US10784075B2

公开(公告)日：2020-09-22

申请号：US16655012

申请日：2019-10-16

申请人： NISSIN ION EQUIPMENT CO., LTD.

发明人： Shinya Hisada ,  Kohei Tanaka ,  Shigehisa Tamura ,  Makoto Nakaya

IPC分类号： H01J37/36 ,  H01J37/20 ,  H01J37/18

摘要： An apparatus provided with a wafer processing chamber that houses a wafer supporting mechanism supporting a wafer and is used to irradiate the wafer supported by the wafer supporting mechanism with an ion beam and a transport mechanism housing chamber that houses a transport mechanism provided underneath the wafer processing chamber and used for moving the wafer supporting mechanism in a substantially horizontal direction, wherein an aperture used for moving the wafer supporting mechanism along with a coupling member coupling the wafer supporting mechanism to the transport mechanism is formed in the direction of movement of the transport mechanism in a partition wall separating the wafer processing chamber from the transport mechanism housing chamber.