公开(公告)号：US10411173B2

公开(公告)日：2019-09-10

申请号：US15086873

申请日：2016-03-31

Applicant: NICHIA CORPORATION

Inventor： Takanori Aruga ,  Yoshiki Endo ,  Takuya Yamanoi ,  Daisuke Kishikawa ,  Yoshitaka Tanaka

IPC: H01L33/00 ,  H01L33/60 ,  H01L33/54 ,  H01L33/58 ,  H01L25/13 ,  H01L33/62

Abstract: A light emitting device and light emitting module using the same are provided. The light emitting device includes a substrate, a light-emitting element provided on the substrate, and a light transmissive sealing member covering the light-emitting element on the substrate. The light transmissive sealing member includes a body portion and a lens portion that are sequentially disposed from a substrate side.

公开(公告)号：US11264541B2

公开(公告)日：2022-03-01

申请号：US16811965

申请日：2020-03-06

Applicant: NICHIA CORPORATION

Inventor： Naoki Ishida ,  Takuya Yamanoi ,  Hirofumi Yoshida

IPC: H01L33/44 ,  H01L33/32 ,  H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

Abstract: A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.

公开(公告)号：US11764334B2

公开(公告)日：2023-09-19

申请号：US17579998

申请日：2022-01-20

Applicant: NICHIA CORPORATION

Inventor： Naoki Ishida ,  Takuya Yamanoi ,  Hirofumi Yoshida

IPC: H01L33/44 ,  H01L33/32 ,  H01L33/00 ,  H01L33/62 ,  H01L33/48 ,  H01L33/50

CPC classification number: H01L33/44 ,  H01L33/0075 ,  H01L33/32 ,  H01L33/486 ,  H01L33/507 ,  H01L33/62 ,  H01L2933/0025

Abstract: A light emitting device includes a package having an upper surface and an upward-opening recess defined in a portion of the upper surface, at least one light-emitting element in the recess, a light-transmissive member covering the opening of the recess, and an antireflection film on a lower surface of the light-transmissive member, the antireflection film located between the lower surface of the light-transmissive member and an upper surface of the package at a location where a portion of the lower surface of the light-transmissive member is bonded to the upper surface of the package via the antireflection film. A coating film is disposed on at least a portion of an outer surfaces of the light emitting device, the portion including a region where the antireflection film located between the lower surface of the light-transmissive member and the upper surface of the package is exposed.