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公开(公告)号:US20240418578A1
公开(公告)日:2024-12-19
申请号:US18333566
申请日:2023-06-13
Inventor: SHIANG-FENG TANG , SHUN-LUNG YEN , KUO-JEN CHANG , HSIN-CHANG CHEN
Abstract: An accurate temperature measurement structure of a wide temperature range includes: a lens set; an optical base, having a neutral density slot and being fixed with the lens set by a first screw; a mask shutter assembly, fixed with the optical base by a second screw; and a temperature sensing unit, for sensing a target object temperature so as to obtain a measured temperature value, the temperature sensing unit performing a temperature normalization correction when the accurate temperature measurement structure of the wide temperature range is in a power-on stage to obtain a signal strength value, setting a plurality of signal conditions according to the signal strength value to obtain a dynamic linearity strength value and accordingly determining an extreme value region, so as to determine whether to add a neutral density filter to the neutral density slot.
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2.
公开(公告)号:US20230408342A1
公开(公告)日:2023-12-21
申请号:US17844758
申请日:2022-06-21
Inventor: SHIANG-FENG TANG , SHUN-LUNG YEN , KUO-JEN CHANG , HSIN-CHANG CHEN
CPC classification number: G01J5/808 , G01J5/0205 , G01J2005/0077
Abstract: A temperature measurement calibration method without interference of a shutter of a thermal imaging module comprises steps: at a temperature of a core chip of a thermal imaging module, obtaining a response value generated by measuring a blackbody temperature after the shutter is started at a frame time; performing a linear regression analysis of the response value to obtain a correction response value equation; inputting the response value into the correction response value equation; and obtaining a correction response value of measuring the blackbody temperature.
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3.
公开(公告)号:US20230314238A1
公开(公告)日:2023-10-05
申请号:US17707997
申请日:2022-03-30
Inventor: SHIANG-FENG TANG , SHUN-LUNG YEN , KUO-JEN CHANG , HSIN-CHANG CHEN
Abstract: A method of stabilizing temperature sensing in presence of temperature-sensing component temperature variation includes steps of: obtaining response value caused by black body at first temperature of a thermal imager core chip; obtaining high-temperature first-order linear function of high-temperature black body response value versus thermal imager core chip temperature; obtaining low-temperature first-order linear function of low-temperature black body response value versus thermal imager core chip temperature; obtaining response value of high-temperature first-order linear function at first temperature, response value of high-temperature first-order linear function at second temperature of the thermal imager core chip, response value of low-temperature first-order linear function at first temperature, response value of low-temperature first-order linear function at second temperature, and response value of black body and substituting the five values into an equation for correcting the response values; and obtaining instant corrected value of the response value of the black body.
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