公开(公告)号：US20220418102A1

公开(公告)日：2022-12-29

申请号：US17897747

申请日：2022-08-29

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Kosuke NISHIO ,  Kazuya SODA

IPC: H05K1/02 ,  H05K1/11 ,  H05K3/46 ,  H05K3/40

Abstract: A multilayer substrate includes a multilayer body in which insulating layers are laminated in a laminating direction, a front electrode that is provided on a front surface side of a first insulating layer which is positioned on a front surface side of the multilayer body among the insulating layers, a first internal electrode that is provided on an opposite side to the front electrode with the first insulating layer interposed therebetween, and a first interlayer connection conductor that electrically connects the front electrode and the first internal electrode with each other. The first interlayer connection conductor includes a front side connection surface that is electrically connected with the front electrode and a back side connection surface that is electrically connected with the first internal electrode.