CHIP INDUCTOR
    1.
    发明申请
    CHIP INDUCTOR 审中-公开

    公开(公告)号:US20180166206A1

    公开(公告)日:2018-06-14

    申请号:US15788843

    申请日:2017-10-20

    Abstract: In a multilayer body including a plurality of laminated insulating material layers on which a plurality of coil patterns are provided, the plurality of coil patterns are connected to each other to form a coil having a coil axis parallel to a lamination direction. A pair of outer electrodes connected to the coil are disposed at both ends in the lamination direction. When a direction orthogonal to the lamination direction is defined in an up-down direction, the coil patterns are disposed within the multilayer body so as to be shifted to an upper side. At least a portion of a vertical projection image of the coil on a virtual plane orthogonal to the lamination direction does not overlap a vertical projection image of the outer electrodes on the virtual plane.

    LAMINATED COIL COMPONENT
    2.
    发明申请
    LAMINATED COIL COMPONENT 有权
    层压线圈组件

    公开(公告)号:US20160284463A1

    公开(公告)日:2016-09-29

    申请号:US15080078

    申请日:2016-03-24

    CPC classification number: H01F17/0013 H01F2017/002

    Abstract: A laminated coil component has an element body formed by laminating a plurality of ceramic layers, and a coil conductor disposed inside the element body. The coil conductor has coil pattern portions disposed on the plurality of the ceramic layers and including line portions and land portions disposed at ends of the line portions, and pattern connecting portions connecting the land portion to each other between the coil pattern portions arranged adjacently in a laminating direction of the ceramic layers. The land portions overlap with the line portions located on the opposite side of the pattern connecting portions in the laminating direction when viewed in the laminating direction such that the centers of the land portions do not overlap with the line portions located on the opposite side of the pattern connecting portions in the laminating direction when viewed in the laminating direction.

    Abstract translation: 层叠线圈部件具有通过层叠多个陶瓷层而形成的元件体,以及设置在元件主体内的线圈导体。 线圈导体具有设置在多个陶瓷层上的线圈图案部分,并且包括设置在线路部分的端部处的线部分和接地部分,以及在相邻布置的线圈图案部分之间连接接地部分的图案连接部分 陶瓷层的层叠方向。 当沿着层叠方向观察时,地面部分与位于层叠方向上的图案连接部分相对侧的线部分重叠,使得接合部分的中心不与位于相邻侧面处的线部分重叠 在层叠方向上观察时的层叠方向的图案连接部。

    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF
    3.
    发明申请
    ELECTRONIC COMPONENT AND MANUFACTURING METHOD THEREOF 有权
    电子元器件及其制造方法

    公开(公告)号:US20130088316A1

    公开(公告)日:2013-04-11

    申请号:US13692827

    申请日:2012-12-03

    Abstract: An electronic component that can be prevented from being mounted on a circuit board with inclination, and a manufacturing method thereof are provided. An electronic component is mountable on a circuit board including a first land and a second land. The electronic component includes outer electrodes on a lower surface of a stack to be arranged along a direction and are connectable to the first land and the second land, respectively. With the eletronic component mounted to the circuit board, respective contact surfaces of the outer electrodes to the first land and the second land have a structure being symmetric about a line parallel to the direction, and each respective contact surface is divided into a plurality of portions.

    Abstract translation: 提供可以防止倾斜地安装在电路板上的电子部件及其制造方法。 电子部件安装在包括第一焊盘和第二焊盘的电路板上。 电子部件包括沿着方向布置的层叠体的下表面上的外部电极,并且能够分别连接到第一焊盘和第二焊盘。 通过将电子部件安装到电路板,外电极到第一焊盘和第二焊盘的相应接触表面具有关于平行于该方向的线对称的结构,并且每个相应的接触表面被分成多个部分 。

    ELECTRONIC COMPONENT
    4.
    发明申请
    ELECTRONIC COMPONENT 有权
    电子元件

    公开(公告)号:US20130093558A1

    公开(公告)日:2013-04-18

    申请号:US13693999

    申请日:2012-12-04

    Abstract: An electronic component that can be prevented from being shifted from a normal mount position and can be manufactured with a low cost is provided. The component is configured by stacking a plurality of insulating layers and a plurality of inner conductors provided on the respective insulating layers. The connection conductors have respective exposure portions that are each exposed between corresponding ones of the insulating layers at a surface of the stack. An outer electrode is formed, for example, by plating on the lower surface so that the exposure portions are covered with the outer electrode. The plurality of exposure portions do not have uniform thicknesses or are not arranged at uniform intervals in the stacking direction.

    Abstract translation: 可以提供能够防止从正常安装位置偏移并且可以以低成本制造的电子部件。 该部件通过堆叠多个绝缘层和设置在各绝缘层上的多个内部导体而构成。 连接导体具有各自的曝光部分,每个曝光部分在堆叠的表面处暴露在相应的绝缘层之间。 外部电极例如通过在下表面上电镀形成,使得曝光部分被外部电极覆盖。 多个曝光部不具有均匀的厚度,也不在层叠方向上以均匀的间隔配置。

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