公开(公告)号：US11177593B2

公开(公告)日：2021-11-16

申请号：US16886917

申请日：2020-05-29

申请人： Molex, LLC

发明人： Han-Lin Goh ,  Daw-Wei Lee ,  Ser-Kiat Toh

IPC分类号： H01R13/648 ,  H01R12/71 ,  H01R13/6591 ,  H01R13/6581 ,  H01R13/514

摘要： The present disclosure provides a connector that comprises a housing and wafers. The housing comprises a top wall and a bottom wall separated from each other in a mounting direction. The wafers are mated to the housing in a mating direction and supported by the housing. A first wafer is configured to be limited in the mounting direction. A second wafer is configured to be limited in the mating direction. A possible benefit from a match between a limiting block of the first wafer and a limiting groove of the housing and a match between the limiting block of the first wafer and a limiting opening of the housing is that the first wafer is less easy to move between the top wall and the bottom wall of the housing along the mounting direction and can be more firmly supported by the housing.