公开(公告)号：US20190157172A1

公开(公告)日：2019-05-23

申请号：US16257585

申请日：2019-01-25

申请人： Micron Technology, Inc.

发明人： Kean Tat Koh ,  Lien Wah Choong

IPC分类号： H01L23/29 ,  B29C33/42 ,  H01L23/31 ,  B29C33/28 ,  B29C33/30

摘要： Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.

公开(公告)号：US10199299B1

公开(公告)日：2019-02-05

申请号：US15670351

申请日：2017-08-07

申请人： Micron Technology, Inc.

发明人： Kean Tat Koh ,  Lien Wah Choong

IPC分类号： H01L23/29 ,  H01L23/31 ,  B29C33/28 ,  B29C33/30 ,  B29C33/42

摘要： Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.

公开(公告)号：US10658256B2

公开(公告)日：2020-05-19

申请号：US16257585

申请日：2019-01-25

申请人： Micron Technology, Inc.

发明人： Kean Tat Koh ,  Lien Wah Choong

IPC分类号： H01L23/29 ,  H01L23/31 ,  B29C33/28 ,  B29C33/30 ,  B29C33/42 ,  H01L21/56 ,  B29C43/18 ,  B29C43/00

摘要： Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes providing a sheet mold compound, and dispensing a granular mold compound directly on the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed granular mold compound to a molding machine without using a release film.

公开(公告)号：US20190043773A1

公开(公告)日：2019-02-07

申请号：US15670351

申请日：2017-08-07

申请人： Micron Technology, Inc.

发明人： Kean Tat Koh ,  Lien Wah Choong

IPC分类号： H01L23/29 ,  H01L23/31 ,  B29C33/28 ,  B29C33/30 ,  B29C33/42

摘要： Mold compound transfer systems and methods for making mold compound transfer systems are disclosed herein. A method configured in accordance with a particular embodiment includes placing a sheet mold compound in a containment area defined by a tray cover, and dispensing a granular mold compound over the sheet mold compound. The sheet mold compound can have a first density and the overall granular mold compound can have a second density less than the first density. The method further comprises transferring the solid sheet carrying the dispensed grains to a molding machine without using a release film.