Compact package for electronic module
    1.
    发明授权
    Compact package for electronic module 失效
    电子模块紧凑型封装

    公开(公告)号:US5091771A

    公开(公告)日:1992-02-25

    申请号:US351760

    申请日:1989-05-15

    摘要: A very compact package for an electronic data module, which includes battery-backed memory. A two-part metal container is used, which has two shallow concave pieces which fit together. The integrated circuit (in a low-height package, such as a flat-pack or SOIC) is mounted on a very small flexible printed circuit board, which fits inside the container. Laterally spaced from the integrated circuit, on the other end of the small flexible board, the board end is sandwiched between a battery and a piece of elastic conductive material (such as conductive plastic foam). Thus, the battery is connected between one face of the container and a power conductor on the board. The piece of elastic conductive material makes contact between a data trace on the board and the other face of the container. Another trace on the board makes contact directly to the container face on which the battery's ground terminal is connected. Thus, simple wiring on the small board, using through-hole vias, suffices to route power, ground, and data lines to the integrated circuit, while providing a sealed durable package with two external contacts.

    摘要翻译: 用于电子数据模块的非常紧凑的封装,包括电池备份存储器。 使用两部分金属容器,其具有两个装配在一起的浅凹片。 集成电路(在低包装中,如扁平封装或SOIC)安装在适合容器内部的非常小的柔性印刷电路板上。 与集成电路相隔一定距离,在小型柔性板的另一端,板端被夹在电池和一块弹性导电材料(如导电塑料泡沫)之间。 因此,电池连接在容器的一个面和电路板上的电源导体之间。 弹性导电材料使板上的数据迹线与容器的另一面接触。 电路板上的另一个痕迹直接与电池接地端子连接的容器面接触。 因此,使用通孔通孔的小型板上的简单接线就足以将电源,地线和数据线路路由到集成电路,同时提供具有两个外部触点的密封耐用封装。