公开(公告)号：US20220248521A1

公开(公告)日：2022-08-04

申请号：US17585893

申请日：2022-01-27

Applicant: Mettler-Toledo, LLC

Inventor： Long Qian ,  Hao Cao ,  Heming Song ,  József Varga ,  William Miller

IPC: H05F3/04 ,  H01H13/70 ,  H05K5/00 ,  H01H9/48

Abstract: A plastic keypad with data entry elements and at least one display element is protected from electrostatic discharge by an assembly having an overlay substrate on which an electrically-conductive arrangement is disposed. The overlay substrate has a top side and a back side with a precisely-positioned vias formed through the substrate. A top surface of the top side is a layer of a conductive polymer. The back side is printed with at least one layer of color ink that depict a plurality of alpha-numerical and pictorial elements of the keypad. The electrically-conductive arrangement is disposed on the overlay substrate to collect electrostatic charges on the top side, transfer the electrostatic charges to the back side through the plurality of vias and drain the transferred electrostatic charges to a ground.

公开(公告)号：US12035449B2

公开(公告)日：2024-07-09

申请号：US17585893

申请日：2022-01-27

Applicant: Mettler-Toledo, LLC

Inventor： Long Qian ,  Hao Cao ,  Heming Song ,  József Varga ,  William Miller

IPC: H05F3/04 ,  H01H9/48 ,  H01H13/70 ,  H05K5/00

CPC classification number: H05F3/04 ,  H01H9/48 ,  H01H13/70 ,  H05K5/0017

Abstract: A plastic keypad with data entry elements and at least one display element is protected from electrostatic discharge by an assembly having an overlay substrate on which an electrically-conductive arrangement is disposed. The overlay substrate has a top side and a back side with a precisely-positioned vias formed through the substrate. A top surface of the top side is a layer of a conductive polymer. The back side is printed with at least one layer of color ink that depict a plurality of alpha-numerical and pictorial elements of the keypad. The electrically-conductive arrangement is disposed on the overlay substrate to collect electrostatic charges on the top side, transfer the electrostatic charges to the back side through the plurality of vias and drain the transferred electrostatic charges to a ground.