公开(公告)号：US20240098877A1

公开(公告)日：2024-03-21

申请号：US17848092

申请日：2022-06-23

申请人： Meta Platforms Technologies, LLC

发明人： Michael Nikkhoo ,  Brian Toleno ,  Patrick Codd

IPC分类号： H05K1/02 ,  H05K7/20

CPC分类号： H05K1/0207 ,  H05K7/20309 ,  H05K7/20336

摘要： An interposer equipped with a heat spreader and a multi-board system for an electronic device that includes an interposer equipped with a heat spreader between at least two boards. In examples, the interposer may include a heat spreader having an active portion and, optionally, a passive portion. In examples, the active portion may include a vapor chamber, heat pipe, or isothermal plate. In examples, the passive portion may thermally couple the active portion to a heat dissipation device such as a heat sink and/or an outer frame of the electronic device.

公开(公告)号：US11839054B1

公开(公告)日：2023-12-05

申请号：US17482229

申请日：2021-09-22

申请人： Meta Platforms Technologies, LLC

发明人： Brian Toleno ,  Michael Nikkhoo ,  Patrick Codd

IPC分类号： G06F1/16 ,  H05K5/00 ,  H05K7/00 ,  H05K7/20 ,  H05K1/14 ,  H05K7/06 ,  H05K7/02 ,  H01L25/065

CPC分类号： H05K7/20336 ,  H01L25/0657 ,  H05K1/144 ,  H05K7/023 ,  H05K7/06

摘要： A multi-board system for an electronic device that includes an heat spreader between at least two boards. In examples, the multi-board system may include a stack-PCB architecture on one side of the heat spreader and one or more boards on an opposite side of the heat spreader from the stack-PCB. The heat spreader may comprise a vapor chamber and/or include a graphite layer or core to transfer heat along a length of the heat spreader.

公开(公告)号：US20240297972A1

公开(公告)日：2024-09-05

申请号：US18515793

申请日：2023-11-21

申请人： Meta Platforms Technologies, LLC

发明人： Hanqiao Zhang ,  Patrick Codd ,  Dongmin Yang ,  Yi Zhou ,  Yizhi Xiong ,  Fei Liu ,  Abhishek Dhanda ,  Michael Okincha ,  Linsen Bie ,  Honghong Peng ,  Zhaochun Yu ,  Lidu Huang ,  Shaomin Xiong ,  Gabriel Molina ,  Pablo Castillo Canales ,  Peng Chen ,  Danni Luo ,  Eddie Alex Azuma ,  Kong Boon Yeap ,  Dana Jensen ,  Cameron O'Neill ,  Guangwu Duan ,  Raffael Engleitner ,  David Xu ,  Yibo Liu ,  Ankur Verma ,  Lei Zhao ,  Yuecheng Li ,  Dawei Wang

IPC分类号： H04N13/239 ,  H04N13/156

CPC分类号： H04N13/239 ,  H04N13/156

摘要： An augmented reality apparatus includes a plurality of transmission lines, plural signal-generating circuits, at least one additional transmission line, at least one signal-processing circuit, a multiplexer having a plurality of inputs and at least one output, a plurality of matching networks, and an additional matching network coupling the additional transmission line to the output of the multiplexer. Example AR/VR devices include a camera configured to receive light from the external environment of the device and to provide a camera signal. The camera may include a surface variable lens including a support layer, an optical layer, a membrane layer, and an actuator. A computer-implemented method for anatomical electromyography test design includes identifying a wearable device having a frame including a plurality of electrodes, and calibrating the plurality of electrodes. In augmented reality and virtual reality systems, DNN accelerators may be based on various technologies to improve computing speed and energy efficiency.