-
公开(公告)号：US20170111032A1
公开(公告)日：2017-04-20
申请号：US15274473
申请日：2016-09-23
Applicant: MediaTek Inc.
Inventor： Chun-Neng LIAO , Meng-Hsin CHIANG , Chun-Wei CHANG , Chee-Kong UNG , Ching-Chih LI
Abstract: A semiconductor integrated circuit device includes a chip main circuit, a damper and a passive component. The chip main circuit is coupled to a power source and performs a predetermined function. The damper is coupled to an output terminal of the chip main circuit. The passive component is coupled to the chip main circuit via the damper.
Search Results
1
records
(took 0.009 seconds)
筛选
AND
AND
过滤
NOT
NOT
Scan to Join
