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    TEST SOCKET OF FLEXIBLE SEMICONDUCTOR CHIP PACKAGE AND BENDING TEST METHOD USING THE SAME
    1.
    发明申请
    TEST SOCKET OF FLEXIBLE SEMICONDUCTOR CHIP PACKAGE AND BENDING TEST METHOD USING THE SAME 审中-公开

    公开(公告)号：US20190079114A1

    公开(公告)日：2019-03-14

    申请号：US15992543

    申请日：2018-05-30

    申请人： MagnaChip Semiconductor, Ltd.

    发明人： Jae Sik CHOI ,  Jin Won JEONG ,  Young Sug SEONG ,  Dong Keun LEE

    IPC分类号： G01R1/04

    摘要： A test socket of a flexible semiconductor chip package includes a first bending jig having a convex contour, a second bending jig having a concave contour, and a semiconductor chip package. The second bending jig is disposed to matingly engage the first bending jig. The semiconductor chip package is disposed between the first bending jig and the second bending jig, and includes a flexible tape and a semiconductor chip. The semiconductor chip is disposed on a surface of the flexible tape. Each of the first and second bending jigs has a horizontal length longer than a length of the semiconductor chip and less than a length of the flexible tape.