公开(公告)号：US12215550B2

公开(公告)日：2025-02-04

申请号：US18315198

申请日：2023-05-10

Applicant: Madis XL Ltd.

Inventor： Robert Edward Isted

IPC: E21B17/02 ,  E21B33/127 ,  E21B41/00

Abstract: A well tool pressure compensating system for connecting well tubing sections or well tools and providing pressure and/or thermal compensation along the entire length of the tool in a wellbore. The system can include first and second connectors each including fluid components and power and/or signal components. A tubing allows fluid to travel between the first and second connectors and along the tool. A hose traveling along and within the tool is in fluid communication with a wellbore fluid, thereby providing pressure and thermal compensation along the tool. A flexible tubing extends between the first and second connectors within the tool. The flexible tubing is in fluid communication with an area around the power and/or signal components of the first and second connectors, thereby providing pressure and/or thermal compensation around the power and/or signal components.

公开(公告)号：US20240376787A1

公开(公告)日：2024-11-14

申请号：US18315198

申请日：2023-05-10

Applicant: Madis XL Ltd.

Inventor： Robert Edward Isted

IPC: E21B17/02 ,  E21B41/00

Abstract: A well tool pressure compensating system for connecting well tubing sections or well tools and providing pressure and/or thermal compensation along the entire length of the tool in a wellbore. The system can include first and second connectors each including fluid components and power and/or signal components. A tubing allows fluid to travel between the first and second connectors and along the tool. A hose traveling along and within the tool is in fluid communication with a wellbore fluid, thereby providing pressure and thermal compensation along the tool. A flexible tubing extends between the first and second connectors within the tool. The flexible tubing is in fluid communication with an area around the power and/or signal components of the first and second connectors, thereby providing pressure and/or thermal compensation around the power and/or signal components.