公开(公告)号：US20140312744A1

公开(公告)日：2014-10-23

申请号：US14320776

申请日：2014-07-01

Applicant: MURATA MANUFACTURING CO., LTD.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01C7/00 ,  H01L41/083 ,  H01F27/28 ,  H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

公开(公告)号：US20140158293A1

公开(公告)日：2014-06-12

申请号：US14177472

申请日：2014-02-11

Applicant: Murata Manufacturing Co., Ltd.

Inventor： Akihiro MOTOKI ,  Makoto OGAWA ,  Kenichi KAWASAKI ,  Shunsuke TAKEUCHI ,  Shigeyuki KURODA

IPC: H01G4/30

CPC classification number: H01C7/008 ,  B05D5/12 ,  H01F27/2804 ,  H01G4/005 ,  H01G4/012 ,  H01G4/228 ,  H01G4/2325 ,  H01G4/30 ,  H01G4/308 ,  H01L41/083

Abstract: A method for manufacturing a multilayer electronic component includes the steps of preparing a laminate including a plurality of laminated insulating layers and a plurality of internal electrodes disposed along interfaces between the insulating layers, edges of the internal electrodes being exposed at a predetermined surface of the laminate, and forming an external electrode on the predetermined surface to electrically connect exposed the edges of the internal electrodes. The step of forming an external electrode includes a plating step of forming a continuous plating film by depositing plating deposits on the edges of the internal electrodes exposed at the predetermined surface and by performing plating growth to be connected to each other, and a heat treatment step of performing a heat treatment at an oxygen partial pressure of about 5 ppm or less and at a temperature of about 600° C. or more.

Abstract translation: 一种多层电子部件的制造方法，其特征在于，具有：制造层叠绝缘层的多个层叠体和沿着绝缘层的界面配置的多个内部电极的层叠体的工序，在所述层叠体的规定表面露出内部电极的边缘 并且在所述预定表面上形成外部电极以电连接所述内部电极的边缘。 形成外部电极的步骤包括：电镀步骤，通过在暴露于预定表面的内部电极的边缘上沉积电镀沉积物并且通过进行电镀生长彼此连接来形成连续的镀膜;以及热处理步骤 在约5ppm或更低的氧分压和约600℃或更高的温度下进行热处理。