公开(公告)号：US20180053673A1

公开(公告)日：2018-02-22

申请号：US15367692

申请日：2016-12-02

Applicant: MIDAS SYSTEM CO., LTD.

Inventor： Gon Chul LEE ,  Heung Ki MIN ,  Jun Hyeong LEE ,  Jae Geun JEON

IPC: H01L21/68 ,  G03F1/42

CPC classification number: H01L21/682 ,  G03F1/42 ,  G03F7/70691 ,  G03F7/70716 ,  G03F7/70808 ,  G03F7/70833 ,  G03F9/7034

Abstract: Embodiments of the invention relate to a stage leveling device for a high-performance mask aligner, having enhanced leveling maintenance and, in particular, a novel technology of preventing leveling misalignment by firmly fixing a leveling-completed wafer stage. The stage leveling device, according to an embodiment of the invention addresses the problems experienced by conventional leveling devices. According to at least one embodiment, when a locking ring inserted at an outer side of a leveling rod maintains an inclined state, locking is performed such that an inner circumferential surface of the locking ring fixes opposite sides of the leveling rod by applying pressure thereto and, when the locking ring maintains a horizontal state, unlocking is performed such that the inner circumferential surface of the locking ring is spaced apart from the leveling rod.