CONDUCTING HEAT THROUGH A HINGE
    1.
    发明申请

    公开(公告)号:US20190354148A1

    公开(公告)日:2019-11-21

    申请号:US15982892

    申请日:2018-05-17

    摘要: Examples are disclosed that relate to heat transfer devices comprising a vapor chamber and a flexible hinge. One disclosed example provides an electronic device comprising a first portion and a second portion connected by a hinge region, and a vapor chamber extending from the first portion to the second portion across the hinge region, the vapor chamber comprising a first layer comprising titanium, a second layer comprising titanium joined to the first layer to form the vapor chamber, a working fluid within the vapor chamber, and a third layer comprising titanium positioned between the first layer and the second layer, the third layer comprising one or more features configured to conduct the working fluid via capillary action.

    VAPOR CHAMBER HAVING AN ELECTROMAGNETIC SHIELDING LAYER AND METHODS OF MANUFACTURING THE SAME

    公开(公告)号:US20190387642A1

    公开(公告)日:2019-12-19

    申请号:US16009129

    申请日:2018-06-14

    IPC分类号: H05K7/20 H05K9/00

    摘要: A vapor chamber includes an electromagnetic (EM) shielding layer. The vapor chamber is constructed from a structural base material that provides for a suitable size, strength, and/or weight for a specific application. The vapor chamber is treated at the region(s) to provide suitable EM shielding characteristics for the specific application. For example, an oxidation layer is removed from the region(s) to expose the structural base material while the vapor chamber is in an inert environment that prevents further oxidation. Then, while the vapor chamber remains within the same inert environment, a material having suitable electrical conductive properties is deposited onto the exposed structural base material to form an EM shielding layer at the region(s). When the vapor chamber is installed into an electronic device, the EM shielding layer may be electrically grounded so as to isolate one or more components within the electronic device from EM signal interference.

    PERSPIRATION DISSIPATING SUPPORT ASSEMBLY FOR HEAD-MOUNTED DISPLAY DEVICES

    公开(公告)号:US20190331928A1

    公开(公告)日:2019-10-31

    申请号:US15965631

    申请日:2018-04-27

    IPC分类号: G02B27/01 G02C11/08

    摘要: A perspiration dissipating support assembly for head-mounted-display (HMD) devices. Variations of the perspiration dissipating support assembly disclosed herein enable supporting forces for an HMD device to be spread over a large portion of a user's head while facilitating dissipation of both liquid perspiration and vapor perspiration via respective dedicated dissipation mechanisms. In some embodiments, the perspiration dissipating support assembly includes a vapor-permeable contact layer that contacts the user's head and a vapor-permeable spacer that provides a Moisture Vapor Transmission Rate on the order of several times greater than that of the vapor-permeable contact layer. The vapor-permeable contact layer may have wicking properties that tend to draw perspiration (e.g., via capillary action resulting from a particular technical-weave pattern) away from the user's head and into the vapor-permeable spacer through which the perspiration evaporates into the ambient environment. The vapor-permeable spacer may be a three-dimensional fabric and/or an open-cell foam.

    SEALING A HEAT PIPE
    5.
    发明申请
    SEALING A HEAT PIPE 审中-公开

    公开(公告)号:US20190113289A1

    公开(公告)日:2019-04-18

    申请号:US15782489

    申请日:2017-10-12

    IPC分类号: F28D15/02 F28D15/04

    摘要: Examples are disclosed that relate to sealing a heat pipe. One example provides a heat pipe including a heat pipe body having a sealed end at which opposing interior surfaces of the heat pipe body are joined, a sealant located in a least a portion of the sealed end of the heat pipe body between the opposing interior surface, the sealant having a higher oxygen transport rate than the heat pipe body, and a permanent seal forming an outer surface of the sealed end.