公开(公告)号：US20210225822A1

公开(公告)日：2021-07-22

申请号：US17005528

申请日：2020-08-28

Applicant: MEDIATEK Inc.

Inventor： Tien-Yu LU ,  Chu-Wei HU ,  Hsin-Hsin HSIAO

IPC: H01L25/16 ,  H01L23/538

Abstract: A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval.

公开(公告)号：US20220246591A1

公开(公告)日：2022-08-04

申请号：US17726595

申请日：2022-04-22

Applicant: MEDIATEK Inc.

Inventor： Tien-Yu LU ,  Chu-Wei HU ,  Hsin-Hsin HSIAO

IPC: H01L25/16 ,  H01L23/538

Abstract: A semiconductor package includes a first substrate, a second substrate, a conductive component, an electronic component and a passive component. The conductive component is disposed between the first substrate and the second substrate, wherein the first substrate and the second substrate are separated from each other by an interval. The electronic component and the passive component are disposed within the interval.